Open-Access Instruments
New Chet
High-pressure thermal evaporation system for confinement heteroepitaxy (CHet) of 2D metals and alloys. Substrates 5–100 mm, heated to 1000°C, with 1–30 RPM rotation. Evacuation by turbo pumps to <5×10^-7 Torr; pressure up to 20 Torr with closed-loop control. Three evaporation sources; ion/plasma aids graphene. Gases: N2, Ar, Ar/H2, O2.
Next Generation SAXS/WAXS System
A state-of-the-art X-ray system dedicated to characterization of biomaterials.
Nicoya Alto Surface Plasmon Resonance (SPR)
Nicoya’s Alto SPR is a high-throughput benchtop SPR that provides high-quality binding kinetics and affinity data for a wide variety of glycomaterial interactions. The Alto SPR utilizes digital microfluidics (DMF) with nanotechnology-based biosensors to accurately control and manipulate discrete nanoliter-sized droplets through applying voltage on an array of electrodes.
Nicoya Open Surface Plasmon Resonance (SPR)
Nicoya’s Open SPR is a high-quality benchtop SPR that provides label-free binding kinetics, affinity, and thermodynamics data for a wide variety of molecular interactions. The Open SPR utilizes nanotechnology-based sensors to deliver repeatable and highly sensitive kinetic data.
Nion UltraSTEM
The NION UltraStem 100 comes with a cold field emission gun, electron optics that can be changed to produce a 2-3 angstrom probe with 1 nA or more of current for analytical purposes, a high-stability stage that enables atomic-resolution EELS mapping over large length scales, and other features.
Octet RED384 Biolayer Interferometry (BLI)
Octet systems enable real-time, label-free analysis for determination of affinity, kinetics, and antibody/protein quantitation. Based on Bio-Layer Interferometry (BLI), this fluidics-free instrument platform offers a number of advantages over traditional label-free techniques including operation in a 384-well format.
RMN3
Glovebox-mounted Witec Apyron Alpha 300R confocal microscope enables Raman and photoluminescence measurements. Fully automated for laser switching (532/633 nm), gratings (300/600/1800 l/mm), objectives (x5/x10/x50/x100), focus, and XY stage. Detectors resolve 10 cm^-1 (532 nm) and 0.1 cm^-1 (632 nm). Includes Linkam LTSE cryostage (-196 to 200°C) with four tungsten probes.
Rocking Compounding Furnace
The 2DCC compounding furnace is a single-zone unit reaching up to 1250 °C, used to mix source powders for later crystal growth in Vertical Bridgman or chemical vapor transport furnaces. It accommodates ampoules up to 2 inches in diameter (or multiple smaller) and tilts during mixing to improve uniformity.
SICG (Francesca)
An in-house graphite hot-zone furnace for epitaxial graphene, heating up to ~2500 °C, with a 4×6 inch work zone for 5 mm to 4" wafers in custom crucibles. Vacuum to 10−6 Torr (rotary vane and diffusion pumps). Ar carrier gas and H2/CH4 precursors; 1–1000 Torr operating pressure.
STM1
Nanoprobe STM with 4 independent tips enables 4-point electrical transport to 4.5 K. An integrated SEM positions tips over sample features with <1 μm resolution. Each tip can perform STM, but only one at a time. A coil provides up to 200 gauss field. Argon sputtering cleans tips and samples.
Sample Alignment and Cutting Facility
PARADIM has capability for sample alignment and cutting through instrument cross-sharing agreements.
Shimadzu Nexera Hybrid HPLC
Reverse-Phase Analytical/Preparative Hybrid HPLC-MS for the automated purification of peptoids, peptides, oligomers, and small molecules.
Solution Mask Liquid Lithography (SMaLL) 3D printing system
A custom-built 3D printing system.
Spark Plasma Sintering
Spark plasma sintering (SPS), also known as field assisted sintering technique or pulsed electric current sintering, or Plasma Pressure Compaction, is a sintering technique in which powdered sample can be sintered under uniaxial pressure.
Stratasys F270 FDM Printer
Fast and precise fused deposition modeling printer.
Stratasys Objet30 Pro Polyjet Printer
Versatile, high-accuracy polyjet printer.
TFS Helios G4 UX DualBeam FIB
A tool in Electron Microscopy with high resolution due to its next-gen UC+ Technology.
Texture Technologies Texture Analyzer
Mechanical testing capabilities for soft materials.
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