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Open-Access Instruments

New Chet

New Chet

High-pressure thermal evaporation system for confinement heteroepitaxy (CHet) of 2D metals and alloys. Substrates 5–100 mm, heated to 1000°C, with 1–30 RPM rotation. Evacuation by turbo pumps to <5×10^-7 Torr; pressure up to 20 Torr with closed-loop control. Three evaporation sources; ion/plasma aids graphene. Gases: N2, Ar, Ar/H2, O2.

Next Generation SAXS/WAXS System

A state-of-the-art X-ray system dedicated to characterization of biomaterials.

Nicoya Alto Surface Plasmon Resonance (SPR)

Nicoya’s Alto SPR is a high-throughput benchtop SPR that provides high-quality binding kinetics and affinity data for a wide variety of glycomaterial interactions. The Alto SPR utilizes digital microfluidics (DMF) with nanotechnology-based biosensors to accurately control and manipulate discrete nanoliter-sized droplets through applying voltage on an array of electrodes.

Nicoya Open Surface Plasmon Resonance (SPR)

Nicoya’s Open SPR is a high-quality benchtop SPR that provides label-free binding kinetics, affinity, and thermodynamics data for a wide variety of molecular interactions. The Open SPR utilizes nanotechnology-based sensors to deliver repeatable and highly sensitive kinetic data.

Nion UltraSTEM

The NION UltraStem 100 comes with a cold field emission gun, electron optics that can be changed to produce a 2-3 angstrom probe with 1 nA or more of current for analytical purposes, a high-stability stage that enables atomic-resolution EELS mapping over large length scales, and other features.

Octet RED384 Biolayer Interferometry (BLI)

Octet systems enable real-time, label-free analysis for determination of affinity, kinetics, and antibody/protein quantitation. Based on Bio-Layer Interferometry (BLI), this fluidics-free instrument platform offers a number of advantages over traditional label-free techniques including operation in a 384-well format.
RMN3

RMN3

Glovebox-mounted Witec Apyron Alpha 300R confocal microscope enables Raman and photoluminescence measurements. Fully automated for laser switching (532/633 nm), gratings (300/600/1800 l/mm), objectives (x5/x10/x50/x100), focus, and XY stage. Detectors resolve 10 cm^-1 (532 nm) and 0.1 cm^-1 (632 nm). Includes Linkam LTSE cryostage (-196 to 200°C) with four tungsten probes.
Rocking Compounding Furnace

Rocking Compounding Furnace

The 2DCC compounding furnace is a single-zone unit reaching up to 1250 °C, used to mix source powders for later crystal growth in Vertical Bridgman or chemical vapor transport furnaces. It accommodates ampoules up to 2 inches in diameter (or multiple smaller) and tilts during mixing to improve uniformity.
SICG (Francesca)

SICG (Francesca)

An in-house graphite hot-zone furnace for epitaxial graphene, heating up to ~2500 °C, with a 4×6 inch work zone for 5 mm to 4" wafers in custom crucibles. Vacuum to 10−6 Torr (rotary vane and diffusion pumps). Ar carrier gas and H2/CH4 precursors; 1–1000 Torr operating pressure.
STM1

STM1

Nanoprobe STM with 4 independent tips enables 4-point electrical transport to 4.5 K. An integrated SEM positions tips over sample features with <1 μm resolution. Each tip can perform STM, but only one at a time. A coil provides up to 200 gauss field. Argon sputtering cleans tips and samples.

Sample Alignment and Cutting Facility

PARADIM has capability for sample alignment and cutting through instrument cross-sharing agreements.

Shimadzu Nexera Hybrid HPLC

Reverse-Phase Analytical/Preparative Hybrid HPLC-MS for the automated purification of peptoids, peptides, oligomers, and small molecules.

Spark Plasma Sintering

Spark plasma sintering (SPS), also known as field assisted sintering technique or pulsed electric current sintering, or Plasma Pressure Compaction, is a sintering technique in which powdered sample can be sintered under uniaxial pressure.

Stratasys F270 FDM Printer

Fast and precise fused deposition modeling printer.

Stratasys Objet30 Pro Polyjet Printer

Versatile, high-accuracy polyjet printer.

TFS Helios G4 UX DualBeam FIB

A tool in Electron Microscopy with high resolution due to its next-gen UC+ Technology.

Texture Technologies Texture Analyzer

Mechanical testing capabilities for soft materials.