Tools & Facilities

A two-zone 2DCC furnace (max 1100°C) is used for chemical vapor transport. Each bore accommodates an ampoule up to 2 inches in diameter (or multiple smaller ones). Computer-controlled operation enables multi-segment ramp-and-dwell temperature profiles and logs growth-condition data during each run.

The 2DCC Inert Atmosphere Cluster Tool enables fabrication and characterization of air-sensitive van der Waals heterostructures in argon gloveboxes. It combines a HQ Graphene transfer stage, an MFP-3D AFM, and a two-box system with PVD, offering precise 9-DOF transfer, multi-objective imaging, 200°C control, vacuum transfer, exfoliation, and a hot plate.

A four-zone 2DCC furnace (max 1100 °C) supports chemical vapor transport. Each bore accommodates an ampoule up to 2 inches in diameter or several smaller ones. Computer-controlled operation enables multi-segment ramp and dwell temperature profiles and logs growth-condition data during each run.

 The signature tool in PARADIM’s Thin Film Facility is a fully automated MBE system in which users can select among 62 elements of the periodic table to make the inorganic materials they desire.

The cryogenic ARPES module features a high intensity helium plasma source and monochromator, allowing energy- and momentum-resolved electronic structure characterization of thin films and single crystals with He 1 (21.22 eV, 23.08 eV), or He 2 (41.81 eV) photon excitation down to a sample temperature below 20 K. The DA-30L

KMLabs Yi‑Fi Laser Light Source for ARPES uses high-harmonic generation to deliver four excitation energies 7.2–10.8 eV with high intensity and meV-scale energy resolution. Coupled to a cryogenic ARPES module with a DA‑30L spherical analyzer, base pressure is 3×10^-10 mBar.

PARADIM boasts significant ancillary synthesis capabilities to meet user needs. This includes box and tube furnaces, a multizone chemical vapor transport furnace, and a glove box adopted arc melting furnace for air sensitive materials.

Angle-Resolved Photoemission Spectroscopy (ARPES) is the premiere experimental tool for directly accessing electronic structure in quantum materials.

Anton Paar’s modular compact rheometer (MCR) 302 can measure the flow behavior and viscoelastic properties of samples ranging from low-viscosity liquids to soft solids (gels). Measurements can be conducted in rotational and oscillatory modes and with different measuring geometries, such as concentric cylinders or cone-and-plate.

The 2DCC Inert Atmosphere Cluster Tool enables the fabrication and characterization of air-sensitive van der Waals heterostructures and devices. It consists of three major pieces of instrumentation housed in two conjoined, argon gas-filled gloveboxes. The tool features a state-of-the-art transfer stage from HQ Graphene, an atomic force microscope from Asylum

BioTools’ ChiralIR-2X VCD spectrometer offers all digital processing to improve the stability and suppress instrument artifacts allowing the simultaneous monitoring of infrared (IR) and VCD spectra.

BioTools’ ChiralRAMAN-2X ROA spectrometer provides Raman and ROA spectra of liquid and gel materials. The instrument utilizes a 2-watt laser to provide the complete vibrational spectrum (from ~100 to 2000 cm-1), collecting Raman spectra in as little as 150 msec.

Flash chromatography system equipped with an external evaporative light-scattering detector.

Aqueous or organic solvent evaporator.

The 2DCC has six Muffle Furnaces with a 1200°C max, used for conventional melt growth, flux growth, and solid-state reactions. They’re among the smaller furnaces, accommodating ampoules up to 10 cm (or multiple shorter ones) and heating to 1100°C.

Analysis of a broad range of compounds including small molecules, peptides, proteins, nucleic acids, and synthetic polymers.

The PARADIM Bulk Crystal Growth Facility is located at Johns Hopkins University. Together with the thin film growth facilities at Cornell, it provides unprecedented capabilities for discovery of new materials and interfaces.

State of the art 3D printer capable of creating “layerless” components with smooth external surfaces and solid cross-sectional areas of printed features via continuous liquid interface production technology (CLIP).