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Publications

E. C. McGarrigle, R. Nodel, K. T. Delaney, L. Balents, and G. H. Fredrickson
Thermodynamic stability of a spin microemulsion in Rashba spin-orbit-coupled bosons
Physical Review A 110 (2024)
L. Min, Y. Zhang, Z. Xie, S. V. G. Ayyagari, L. Miao, Y. Onishi, S. H. Lee, Y. Wang, N. Alem, L. Fu, and Z. Mao
Colossal room-temperature non-reciprocal Hall effect
Nature Materials 23 1671-1677 (2024)
C. Li, E. A. Murphy, S. J. Skala, K. T. Delaney, C. J. Hawker, M. S. Shell, and G. H. Fredrickson
Accelerated Prediction of Phase Behavior for Block Copolymer Libraries Using a Molecularly Informed Field Theory
Journal of the American Chemical Society 146 29751-29758 (2024)
L. E. Pepi, A. Shajahan, A. S. Gleinich, C. Heiss, and P. Azadi
Overview of Glycosylation Studies of SARS-CoV-2
Glycoprotein Analysis 1-28 (2024)
N. Watanabe, S. Souma, K. Nakayama, K. Yamauchi, J. F. Ribeiro, Y. Wang, M. Kitamura, K. Horiba, H. Kumigashira, T. Oguchi, Z. Q. Mao, Y. P. Chen, and T. Sato
Ferromagnetism triggered by band tripling in ruthenate Sr4Ru3O10
Physical Review B 110 (2024)
A. Datta, X. Wang, S. D. Mengel, A. J. DeStefano, R. A. Segalman, P. T. Underhill, and M. E. Helgeson
A Gram–Charlier Analysis of Scattering to Describe Nonideal Polymer Conformations
Macromolecules 57 9518-9535 (2024)
G. M. Ferguson, H. P. Nair, N. J. Schreiber, L. Miao, K. M. Shen, D. G. Schlom, and K. C. Nowack
Local magnetic response of superconducting Sr2RuO4 thin films
Physical Review B 110 (2024)
G. Acharya, B. Neupane, C. Hsu, X. P. Yang, D. Graf, E. S. Choi, K. Pandey, M. R. U. Nabi, S. K. Chhetri, R. Basnet, S. Rahman, J. Wang, Z. Hu, B. Da, H. O. H. Churchill, et al.
Insulator‐to‐Metal Transition and Isotropic Gigantic Magnetoresistance in Layered Magnetic Semiconductors
Advanced Materials 36 (2024)
C. A. McCutchin, K. J. Edgar, C. Chen, and P. M. Dove
Silica–Biomacromolecule Interactions: Toward a Mechanistic Understanding of Silicification
Biomacromolecules 26 43-84 (2024)
S. Ghosh, Y. Zheng, Z. Zhang, Y. Sun, T. F. Schranghamer, N. U. Sakib, A. Oberoi, C. Chen, J. M. Redwing, Y. Yang, and S. Das
Monolithic and heterogeneous three-dimensional integration of two-dimensional materials with high-density vias
Nature Electronics 7 892-903 (2024)
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