Penn State and Battalion Advanced Technology Ltd. have entered into two research agreements worth up to $6 million to develop advanced semiconductor platforms and high-temperature materials that aim to enable next-generation energy, transportation, aerospace and industrial systems while also providing critical capabilities for national security.
Led by researchers at Penn State’s Materials Research Institute (MRI), the projects bring together researchers from across the University to address two major materials challenges in technologies that operate under extreme conditions: integrating advanced semiconductors with high-performance substrates that can withstand the conditions and dissipate heat as well as developing durable, oxidation-resistant alloys that can withstand extreme-temperature environments including hypersonic flight.
Battalion Advanced Technology Ltd., a U.K.-based company focused on advancing next-generation materials for dual-use applications, will provide up to $1 million per year for each project. The agreements went into effect on July 16 and will run for three years.
