The Zeiss Xradia 520 Versa is a non-destructive submicron 3D X-ray microscope. Its industry-leading resolution and contrast achieves spatial resolution of 0.7 µm and minimal achievable voxel of 70 nm. This system bridges the resolution gap between light and electron microscopes enabling easy, non-destructive 3D reconstructions of samples. It is equipped with: Dual Scan Contrast Visualizer (DSCoVer), enabling compositional probing through overlay of imaging data of a single sample at two different X-ray spectra. High-Aspect Ratio Tomography (HART) for higher throughput imaging for flat samples like semiconductor packages and boards. Automated filter changer (AFC) for easy X-ray spectrum tuning. Wide field mode & vertical stitching for extended imaging of larger samples. Flat panel extension (FPX) to image significantly larger samples (beyond 5" diameter). CT50000-TEC in-situ interface kit for heating, cooling, tension and compression stage.